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Hudson Components
38, Plant Avenue
Hudson, MA, USA, 01749
Tel:978-3104065
Fax:978-5404466
sales@hudsoncomponents.com

Copyright 2010.All Rights Reserved.
X-RAY
PQFP-100Pins
  • X-ray inspection to ensure that Die Shape and Size are consistant in all samples.
  • X-ray of bonding wires and lead frames are consistant in all samples.
  • X-ray inspection of wire bonding to Lead frames and Die bonding pad.
  • X-ray inspection of defective bonding wires/lead frames/solder joints.
  • Check X-ray printout with our Master Xray reference database.
  • Verify with Manufacturer if needed.
                    SOIC-16Leads                           PLCC-32Leads